JPH03102797U - - Google Patents
Info
- Publication number
- JPH03102797U JPH03102797U JP1235790U JP1235790U JPH03102797U JP H03102797 U JPH03102797 U JP H03102797U JP 1235790 U JP1235790 U JP 1235790U JP 1235790 U JP1235790 U JP 1235790U JP H03102797 U JPH03102797 U JP H03102797U
- Authority
- JP
- Japan
- Prior art keywords
- compressed air
- holes
- head
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims 4
- 238000010438 heat treatment Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1235790U JPH03102797U (en]) | 1990-02-09 | 1990-02-09 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1235790U JPH03102797U (en]) | 1990-02-09 | 1990-02-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03102797U true JPH03102797U (en]) | 1991-10-25 |
Family
ID=31515841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1235790U Pending JPH03102797U (en]) | 1990-02-09 | 1990-02-09 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03102797U (en]) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006110978A (ja) * | 2004-12-21 | 2006-04-27 | Dainippon Printing Co Ltd | 統合アセスメント・コントロール表 |
-
1990
- 1990-02-09 JP JP1235790U patent/JPH03102797U/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006110978A (ja) * | 2004-12-21 | 2006-04-27 | Dainippon Printing Co Ltd | 統合アセスメント・コントロール表 |
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